The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Feb. 18, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Phil Geng, Washougal, WA (US);

Ralph V. Miele, Hillsboro, OR (US);

David Shia, Portland, OR (US);

Sandeep Ahuja, Portland, OR (US);

Jeffory L. Smalley, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); H05K 7/1489 (2013.01); H05K 7/20727 (2013.01);
Abstract

An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.


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