The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Jan. 31, 2019
Intel Corporation, Santa Ana, CA (US);
Shrenik Kothari, Chandler, AZ (US);
Sandeep Ahuja, Portland, OR (US);
Susan Smith, Olympia, WA (US);
Jeffory Smalley, East Olympia, WA (US);
Francisco Gabriel Lozano Sanchez, Tlajomulco de Zuniga, MX;
Maria de la Luz Belmont Velazquez, Zapopan, MX;
Je-Young Chang, Phoenix, AZ (US);
Jorge Contreras Perez, Guadalajara, MX;
Phil Geng, Portland, OR (US);
Andres Ramirez Macias, Zapopan, MX;
Gilberto Rayas Paredes, Zapopan, MX;
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.