Zapopan, Mexico

Gilberto Rayas Paredes


Average Co-Inventor Count = 6.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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3 patents (USPTO):Explore Patents

Title: Gilberto Rayas Paredes: Innovator in Processor Cooling Solutions

Introduction

Gilberto Rayas Paredes is a notable inventor based in Zapopan, Mexico. He has made significant contributions to the field of processor cooling technology, holding 3 patents that showcase his innovative approach to thermal management solutions.

Latest Patents

His latest patents include a "Flexible and modular top and bottom side processor unit module cooling" and a "Multi-surface heat sink suitable for multi-chip packages." The first patent describes a processor unit module that integrates an electronic circuit component on a printed circuit board, utilizing flexible thermal straps to manage heat effectively. The second patent outlines an apparatus that incorporates a multi-surface heat sink, designed to optimize heat distribution and management for integrated circuit dies.

Career Highlights

Gilberto currently works at Intel Corporation, where he applies his expertise in thermal management to enhance processor performance. His work is pivotal in developing efficient cooling solutions that are essential for modern computing technologies.

Collaborations

He collaborates with talented coworkers, including Andres Ramirez Macias and Aardra B Athalye, contributing to innovative projects that push the boundaries of technology.

Conclusion

Gilberto Rayas Paredes exemplifies the spirit of innovation in the tech industry, with his patents reflecting a commitment to improving processor cooling solutions. His contributions are vital for the advancement of efficient thermal management in electronics.

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