The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Jun. 26, 2024
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Andres Ramirez Macias, Zapopan, MX;

Aardra B. Athalye, Beaverton, OR (US);

Devdatta Prakash Kulkarni, Portland, OR (US);

Gilberto Rayas Paredes, Zapopan, MX;

Bijoyraj Sahu, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); H05K 1/0272 (2013.01); G06F 2200/201 (2013.01);
Abstract

Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.


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