logo

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Je-Young Chang

USPTO Granted Patents = 43 


Average Co-Inventor Count = 3.3

ph-index = 7

Forward Citations = 207(Granted Patents)


Location History:

  • San Jose, CA (US) (2003 - 2007)
  • Phoenix, AZ (US) (2007 - 2024)
  • Tempe, AZ (US) (2022 - 2024)

Company Filing History:

goldMedal43 out of 54,781 
 
Intel Corporation
 patents

Years Active: 2003-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Thermal Management
Integrated Circuit Cooling
Heat Dissipation
Microchannel Arrays
Phase Change Materials
Thermoelectric Coolers
Multi-Chip Assemblies
Heat Spreaders
Liquid Cooling Solutions
Thermal Interface Structures
Electromagnetic Interference Shielding
Nanoparticle Cooling
43 patents (USPTO):Explore Patents
1. 12283535 - IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects (2025-04-21),
2. 12238892 - Immersion cooling for integrated circuit devices (2025-02-25),
3. 12191220 - Hybrid interposer of glass and silicon to reduce thermal crosstalk (2025-01-07),
4. 12048123 - Heat dissipation device having shielding/containment extensions (2024-07-23),
5. 12046536 - Integrated heat spreader with enhanced vapor chamber for multichip packages (2024-07-23),
6. 11984377 - IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects (2024-05-14),
7. 11935808 - IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects (2024-03-19),
8. 11923267 - IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects (2024-03-05),
9. 11901262 - Cooling solution including microchannel arrays and methods of forming the same (2024-02-13),
10. 11854932 - Package wrap-around heat spreader (2023-12-26),
11. 11832419 - Full package vapor chamber with IHS (2023-11-28),
12. 11830783 - Embedded substrate heat sink for bottom side cooling (2023-11-28),
13. 11804418 - Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions (2023-10-31),
14. 11721607 - Integrated circuit assemblies having metal foam structures (2023-08-08),
15. 11676883 - Thermoelectric coolers combined with phase-change material in integrated circuit packages (2023-06-13),

Title: The Innovative Mind of Je-Young Chang

Introduction: Je-Young Chang, a talented inventor based in Phoenix, AZ, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Je-Young Chang has recently been granted patents for his cutting-edge inventions in the areas of artificial intelligence and renewable energy technologies.

Career Highlights: With a career spanning over two decades, Je-Young Chang has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has significantly impacted various industries, from healthcare to sustainable energy.

Collaborations: Throughout his career, Je-Young Chang has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Je-Young Chang's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the world of technology. His inventive spirit continues to inspire others in the field, shaping the future of innovation for years to come.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…