The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Mar. 15, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Javed Shaikh, Bangalore, IN;
Je-Young Chang, Tempe, AZ (US);
Kelly Lofgreen, Phoenix, AZ (US);
Weihua Tang, Chandler, AZ (US);
Aastha Uppal, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); H01L 35/10 (2006.01); H01L 35/30 (2006.01); H01L 35/18 (2006.01); H01L 35/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); H01L 35/10 (2013.01); H01L 35/16 (2013.01); H01L 35/18 (2013.01); H01L 35/30 (2013.01);
Abstract
An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.