Intel Corporation

Je-Young Chang

Aastha Uppal

Chandra Mohan Jha

Chia-Pin Chiu

Ravindranath Vithal Mahajan

Ram S Viswanath

Himanshu Pokharna

Zhimin Wan

Debendra Mallik

Gregory Martin Chrysler

Ravi S Prasher

Shankar Devasenathipathy

Elah Bozorg-Grayeli

Ahmad Al Mohammad

Rajiv K Mongia

Edvin Cetegen

Nicholas Neal

Devdatta P Kulkarni

Kyle Jordan Arrington

Weihua Tang

Feras Eid

Ioan Sauciuc

Eric DiStefano

Richard J Dischler

Sergio Antonio Chan Arguedas

Kelly P Lofgreen

David W Song

Choong-Un Kim

Jae W Kim

Robert L Sankman

Omkar G Karhade

Nitin A Deshpande

Michael T Crocker

Alan M Myers

Sanka Ganesan

Chuan Hu

Paul J Gwin

James Chris Matayabas, Jr

Leonel R Arana

Mitul Bharat Modi

James D Williams

Jeffory L Smalley

Ashish Gupta

Mark Charles Carbone

Pramod Malatkar

Dong-Ho Han

Sandeep Ahuja

Jaejin Lee

John William Horigan

Nicholas S Haehn

Patrick D Boyd

Phil Geng

Yiqun Bai

Kuang C Liu

Kyle Yazzie

Sridhar V Machiroutu

Joseph B Petrini

Susan F Smith

Ken P Hackenberg

Raanan Sover

Jerrod Peterson

Shubhada H Sahasrabudhe

Aaron McCann

Arnab Choudhury

Shrenik Kothari

Bradley H Smith

Liwei Wang

Tannaz Harirchian

Prasanna Raghavan

Divya Mani

Andres Ramirez Macias

Gilberto Rayas Paredes

Jan Krajniak

Alexey Chinkov

Michael W Newman

Kumar Abhishek Singh

Jorge Contreras Perez

Balu Pathangey

Blake Rogers

Paul C George

Betsegaw Kebede Gebrehiwot

Venkata Suresh R Guthikonda

Minseok Ha

Mark E Luke

Francisco Gabriel Lozano Sanchez

Nir Peled

Jason Armstrong

Meir Cohen

Maria De La Luz Belmont Velazquez

Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects

A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

Immersion cooling for integrated circuit devices

Embodiments include semiconductor packages. A semiconductor package includes a hybrid interposer with a first region and a second region. The first region is comprised of glass or low thermal conductive materials, and the second region is comprised of silicon or diamond materials. The semiconductor package includes a first die on the first region of the hybrid interposer, a second die on the second region of the hybrid interposer, and an integrated heat spreader over the first die, the second die, and the hybrid interposer. The hybrid interposer includes first and second interconnects, where the first interconnects vertically extend from a bottom surface of the first region to a top surface of the first region, and where the second interconnects vertically extend from a bottom surface of the second region to a top surface of the second region. The first interconnects are through-glass vias, and the second interconnects are through-silicon vias.

Hybrid interposer of glass and silicon to reduce thermal crosstalk

An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device comprising a main body portion and a resilient portion extending from the main body portion, wherein the resilient portion has a plurality of extensions, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a stiffener attached to the electronic substrate, wherein at least a portion of the plurality of extensions of the resilient portion of the heat dissipation device are biased against the stiffener.

Heat dissipation device having shielding/containment extensions

An integrated circuit package includes a first die and second die above a substrate, and a vapor chamber above at least one of the first and second die. A vapor space within the vapor chamber is separated into at least a first section and a second section. The first section may be over the first die, and the second section may be over the second die, for example. The structure separating the first and second sections at least partly restricts flow of vapor between the first and second sections, thereby preventing or reducing thermal cross talk between the first and second dies. In some cases, an anisotropic thermal material is above one of the first or second die, wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of a heat sink than a thermal conductivity in a direction of a section of the vapor chamber.

Integrated heat spreader with enhanced vapor chamber for multichip packages

IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects

IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects

Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.

Cooling solution including microchannel arrays and methods of forming the same

Embodiments disclosed herein include electronic packages and thermal solutions for such electronic packages. In an embodiment, an electronic package comprises, a package substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, the electronic package further comprises a heat spreader, where a first portion of the heat spreader is attached to the first surface of the package substrate and a second portion of the heat spreader is attached to the second surface of the package substrate. In an embodiment, a third portion of the heat spreader adjacent to the sidewall surface of the package substrate connects the first portion of the heat spreader to the second portion of the heat spreader.

Package wrap-around heat spreader

Embodiments include semiconductor packages. A semiconductor package include a high-power electronic component and an embedded heat spreader (EHS) in a package substrate. The EHS is adjacent to the high-power electronic component. The semiconductor package includes a plurality of thermal interconnects below the EHS and the package substrate, and a plurality of dies on the package substrate. The thermal interconnects is coupled to the EHS. The EHS is below the high-power electronic component and embedded within the package substrate. The high-power electronic component has a bottom surface substantially proximate to a top surface of the EHS. The EHS is a copper heat sink, and the high-power electronic component is an air core inductor or a voltage regulator. The thermal interconnects are comprised of thermal ball grid array balls or thermal adhesive materials. The thermal interconnects couple a bottom surface of the package substrate to a top surface of a substrate.

Embedded substrate heat sink for bottom side cooling

Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.

Full package vapor chamber with IHS

A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.

Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions

An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

Integrated circuit assemblies having metal foam structures

An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

Thermoelectric coolers combined with phase-change material in integrated circuit packages

Growing community of inventors

Phoenix, AZ, United States of America

Je-Young Chang