The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Dec. 21, 2020
Intel Corporation, Santa Clara, CA (US);
Raanan Sover, Haifa, IL;
James Williams, Portland, OR (US);
Bradley Smith, Vancouver, WA (US);
Nir Peled, Chandler, AZ (US);
Paul George, Chandler, AZ (US);
Jason Armstrong, Phoenix, AZ (US);
Alexey Chinkov, Haifa, IL;
Meir Cohen, Chandler, AZ (US);
Je-Young Chang, Tempe, AZ (US);
Kuang Liu, Queen Creek, AZ (US);
Ravindranath Mahajan, Chandler, AZ (US);
Kelly Lofgreen, Phoenix, AZ (US);
Kyle Arrington, Gilbert, AZ (US);
Michael Crocker, Portland, OR (US);
Sergio Antonio Chan Arguedas, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.