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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Sergio Antonio Chan Arguedas

This inventor holds 25 USPTO granted patents and 14 published patent applications and 1 EPO patent, primarily in Thermal Interface Materials. Top assignee: Intel Corporation. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sergio Antonio Chan Arguedas. Retrieved from https://idiyas.com/inventor/sergio-antonio-chan-arguedas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 96.0

 

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Gilbert, AZ (US) (2023)
  • Chandler, AZ (US) (2020 - 2024)

Company Filing History:

goldMedal25 out of 56,290 
 
Intel Corporation
 patents

Years Active: 2020-2026

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Areas of Expertise:
Thermal Management
Integrated Circuit
Heat Spreader
Solder Thermal Interface
Microelectronic Package
Cooling Techniques
Additive Manufacturing
Transient Thermal Performance
Electroplated Interconnects
5G mmWave
Polymer Features
Substrate Customization
25 patents (USPTO):Explore Patents
1. 12588499 - Integrated circuit heat spreader including sealant interface material (2026-03-24),
2. 12362250 - Protruding SN substrate features for epoxy flow control (2025-07-15),
3. 12334453 - Soldered metallic reservoirs for enhanced transient and steady-state thermal performance (2025-06-17),
4. 12272614 - Integrated circuit packages with solder thermal interface materials with embedded particles (2025-04-08),
5. 12238892 - Immersion cooling for integrated circuit devices (2025-02-25),
6. 12205915 - Microelectronic package with solder array thermal interface material (SA-TIM) (2025-01-21),
7. 12080620 - Additively manufactured structures for heat dissipation from integrated circuit devices (2024-09-03),
8. 12062592 - Integrated circuit packages with thermal interface materials with different material compositions (2024-08-13),
9. 12009271 - Protruding SN substrate features for epoxy flow control (2024-06-11),
10. 11935799 - Integrated circuit package lids with polymer features (2024-03-19),
11. 11894282 - Vented lids for integrated circuit packages (2024-02-06),
12. 11881438 - First-level integration of second-level thermal interface material for integrated circuit assemblies (2024-01-23),
13. 11832419 - Full package vapor chamber with IHS (2023-11-28),
14. 11817369 - Lids for integrated circuit packages with solder thermal interface materials (2023-11-14),
15. 11798861 - Integrated heat spreader (IHS) with heating element (2023-10-24),

Title: Innovations of Sergio Antonio Chan Arguedas: Pioneering Solutions in Integrated Circuit Technologies

Introduction: Sergio Antonio Chan Arguedas, based in Chandler, AZ, is a prolific inventor with 21 patents to his name. His work primarily focuses on advancements in thermal management and microelectronic packaging, demonstrating a commitment to enhancing the performance and efficiency of integrated circuits.

Latest Patents: Among his latest innovations, two notable patents include a system for immersion cooling in integrated circuit devices and a microelectronic package with solder array thermal interface material (SA-TIM). The immersion cooling patent introduces a two-phase cooling system utilizing boiling enhancement structures, which significantly improve the thermal performance of integrated circuits. The second patent describes a microelectronic package configuration that employs solder thermal interface materials to enhance thermal conductivity between a die and its packaging substrate, ensuring efficient heat dissipation.

Career Highlights: Sergio currently contributes his expertise at Intel Corporation, a leader in semiconductor manufacturing. His role encompasses research and development focused on cutting-edge technologies that are crucial in the fast-evolving landscape of electronics.

Collaborations: Throughout his career, Sergio has collaborated with talented individuals such as Feras Eid and Peng T Li. Together, they have pushed the boundaries of what is possible in thermal management and microelectronic packaging, contributing significantly to the field.

Conclusion: With an impressive portfolio of patents and a strong collaborative spirit, Sergio Antonio Chan Arguedas continues to make impactful contributions to innovation in the technology sector. His work not only advances integrated circuit technologies but also inspires future innovations within the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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