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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11798861 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Jul. 08, 2019

Integrated heat spreader (ihs) with heating element

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Peng Li, Chandler, AZ (US);

Kelly P. Lofgreen, Phoenix, AZ (US);

Manish Dubey, Chandler, AZ (US);

Bamidele Daniel Falola, Chandler, AZ (US);

Ken Hackenberg, Plano, TX (US);

Shenavia S. Howell, Chandler, AZ (US);

Sergio Antonio Chan Arguedas, Chandler, AZ (US);

Yongmei Liu, Chandler, AZ (US);

Deepak Goyal, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Akona IP

Primary Examiner:

Quoc D Hoang

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/48 (2006.01); H01L 23/433 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); H01L 21/4871 (2013.01); H01L 23/367 (2013.01); H01L 23/433 (2013.01);
Abstract

Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

Find Patent Forward Citations

Quick Actions:

Li, Peng. (2023). Integrated heat spreader (ihs) with heating element (U.S. Patent No. 11798861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11798861

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