The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Jun. 07, 2019
Intel Corporation, Santa Clara, CA (US);
Bamidele Daniel Falola, Chandler, AZ (US);
Susmriti Das Mahapatra, Tempe, AZ (US);
Sergio Antonio Chan Arguedas, Chandler, AZ (US);
Peng Li, Chandler, AZ (US);
Amitesh Saha, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.