Phoenix, AZ, United States of America

Amitesh Saha

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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6 patents (USPTO):

Title: Innovations of Inventor Amitesh Saha

Introduction

Amitesh Saha is a prominent inventor based in Phoenix, AZ (US). He has made significant contributions to the field of microelectronics, particularly in the development of integrated circuit packages. With a total of 6 patents to his name, Saha continues to push the boundaries of technology.

Latest Patents

One of his latest patents involves integrated circuit packages with solder thermal interface materials that contain embedded particles. This innovation includes a package substrate, a lid, a die positioned between the package substrate and the lid, and a solder thermal interface material (STIM) situated between the die and the lid. The STIM is designed with embedded particles, some of which have a diameter that matches the distance between the die and the lid. Another notable patent focuses on a microelectronic package that incorporates a solder thermal interface material (STIM) containing indium and a dopant material. This combination aims to enhance the physical and thermal coupling between a die and an integrated heat spreader.

Career Highlights

Amitesh Saha is currently employed at Intel Corporation, where he applies his expertise in microelectronics to develop cutting-edge technologies. His work has been instrumental in advancing the efficiency and performance of integrated circuits.

Collaborations

Saha has collaborated with notable colleagues, including Marco Aurelio Cartas and Bamidele Daniel Falola. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Amitesh Saha's contributions to the field of microelectronics through his patents and work at Intel Corporation highlight his role as a leading inventor. His innovative approaches to integrated circuit packages continue to shape the future of technology.

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