The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
May. 08, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Susmriti Das Mahapatra, Tempe, AZ (US);
Bamidele Daniel Falola, Chandler, AZ (US);
Amitesh Saha, Phoenix, AZ (US);
Peng Li, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 23/3736 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29157 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/32503 (2013.01);
Abstract
Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.