The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
May. 28, 2019
Intel Corporation, Santa Clara, CA (US);
Amitesh Saha, Phoenix, AZ (US);
Sergio Antonio Chan Arguedas, Chandler, AZ (US);
Marco Aurelio Cartas, Chandler, AZ (US);
Ken Hackenberg, Plano, TX (US);
Peng Li, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.