The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Jun. 11, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Manish Dubey, Chandler, AZ (US);
Amitesh Saha, Phoenix, AZ (US);
Marco Aurelio Cartas, Chandler, AZ (US);
Peng Li, Chandler, AZ (US);
Bamidele Daniel Falola, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/3737 (2013.01); H01L 24/17 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Disclosed herein are channeled lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a die between a lid and a package substrate. A bottom surface of the lid may include a channel that at least partially overlaps the die.