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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11935799 B1

PDFFull Text
Date of Patent:
Mar. 19, 2024

Filed:

Jun. 25, 2019

Integrated circuit package lids with polymer features

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Elah Bozorg-Grayeli, Chandler, AZ (US);

Taylor William Gaines, Chandler, AZ (US);

Frederick W. Atadana, Chandler, AZ (US);

Sergio Antonio Chan Arguedas, Chandler, AZ (US);

Robert F. Cheney, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Akona IP PC

Primary Examiner:

Eugene Lee

Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/06 (2013.01); H01L 23/053 (2013.01); H01L 23/49816 (2013.01); H01L 23/3672 (2013.01); H01L 23/42 (2013.01); H01L 25/0655 (2013.01);
Abstract

Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

Find Patent Forward Citations

Bozorg-Grayeli, Elah. (2024). Integrated circuit package lids with polymer features (U.S. Patent No. 11935799). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11935799

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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