The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Jun. 25, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Elah Bozorg-Grayeli, Chandler, AZ (US);
Taylor William Gaines, Chandler, AZ (US);
Frederick W. Atadana, Chandler, AZ (US);
Sergio Antonio Chan Arguedas, Chandler, AZ (US);
Robert F. Cheney, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/06 (2013.01); H01L 23/053 (2013.01); H01L 23/49816 (2013.01); H01L 23/3672 (2013.01); H01L 23/42 (2013.01); H01L 25/0655 (2013.01);
Abstract
Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.