The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Oct. 11, 2019
Intel Corporation, Santa Clara, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments include semiconductor packages. A semiconductor package include a high-power electronic component and an embedded heat spreader (EHS) in a package substrate. The EHS is adjacent to the high-power electronic component. The semiconductor package includes a plurality of thermal interconnects below the EHS and the package substrate, and a plurality of dies on the package substrate. The thermal interconnects is coupled to the EHS. The EHS is below the high-power electronic component and embedded within the package substrate. The high-power electronic component has a bottom surface substantially proximate to a top surface of the EHS. The EHS is a copper heat sink, and the high-power electronic component is an air core inductor or a voltage regulator. The thermal interconnects are comprised of thermal ball grid array balls or thermal adhesive materials. The thermal interconnects couple a bottom surface of the package substrate to a top surface of a substrate.