Chandler, AZ, United States of America

Divya Mani

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2023

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4 patents (USPTO):

Title: Innovations by Divya Mani

Introduction

Divya Mani is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced thermal management solutions that enhance the performance and reliability of electronic components.

Latest Patents

Divya's latest patents include innovative designs such as the "Embedded substrate heat sink for bottom side cooling." This invention involves semiconductor packages that incorporate a high-power electronic component and an embedded heat spreader (EHS) within the package substrate. The EHS is strategically placed adjacent to the high-power electronic component, ensuring efficient thermal management. Another significant patent is for "Thermal management solutions for cored substrates," which describes an integrated circuit assembly featuring a substrate core with heat transfer fluid channels. This design allows for effective cooling within the substrate, significantly reducing thermal damage to integrated circuit devices.

Career Highlights

Divya Mani is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His innovative approaches to thermal management have positioned him as a key contributor in his field.

Collaborations

Divya has collaborated with notable colleagues, including William J. Lambert and Shawna M. Liff, who have contributed to his projects and innovations.

Conclusion

Divya Mani's work exemplifies the importance of innovation in semiconductor technology. His patents reflect a commitment to improving thermal management solutions, which are crucial for the advancement of electronic components.

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