Olympia, WA, United States of America

Susan F Smith

USPTO Granted Patents = 10 

 

Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 2001-2022

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10 patents (USPTO):

Title: The Innovative Contributions of Susan F. Smith

Introduction

Susan F. Smith is a prominent inventor based in Olympia, WA. She has made significant contributions to the field of technology, particularly in thermal management solutions. With a total of 10 patents to her name, her work has had a substantial impact on the industry.

Latest Patents

Among her latest patents is the "Multi-surface heat sink suitable for multi-chip packages." This innovative apparatus incorporates a multi-surface heat sink that includes an integrated circuit die, a heat spreader, a plate element, and a heat sink. The design allows for efficient thermal management by positioning the heat spreader above the IC die and utilizing spring elements to maintain compressive loads. Another notable patent is the "Multi-chip self-adjusting cooling solution," which features a primary device and secondary devices arranged in a planar array. This invention employs passive heat exchangers and springs to optimize cooling efficiency in multi-chip packages.

Career Highlights

Susan F. Smith has built her career at Intel Corporation, where she has been instrumental in developing advanced thermal management technologies. Her innovative designs have not only improved product performance but have also contributed to the overall efficiency of multi-chip systems.

Collaborations

Throughout her career, Susan has collaborated with talented individuals such as Sandeep Ahuja and Jeffory L. Smalley. These partnerships have fostered a creative environment that has led to groundbreaking advancements in thermal solutions.

Conclusion

Susan F. Smith's contributions to the field of technology through her patents and collaborations highlight her role as a leading inventor. Her work continues to influence the industry and pave the way for future innovations.

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