Transient thermal management systems for semiconductor devices

Abstract

Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.