The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Sep. 27, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jeffory L. Smalley, East Olympia, WA (US);

Susan F. Smith, Olympia, WA (US);

Mani Prakash, University Place, WA (US);

Tao Liu, Dupont, WA (US);

Henry C. Bosak, Hillsboro, OR (US);

Harvey R. Kofstad, Vernonia, OR (US);

Almanzo T. Ortiz, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/3675 (2013.01); H01L 23/4093 (2013.01); H01L 23/4338 (2013.01); H01L 25/0655 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.


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