The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Dec. 19, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Vijaykumar Krithivasan, Chandler, AZ (US);

Jeffory L. Smalley, East Olympia, WA (US);

David J. Llapitan, Tacoma, WA (US);

Gaurav Chawla, Tempe, AZ (US);

Mani Prakash, University Place, WA (US);

Susan F. Smith, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/32 (2013.01); H01L 23/36 (2013.01); H01L 23/40 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/1056 (2013.01); H05K 2201/10378 (2013.01);
Abstract

Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…