The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Oct. 20, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Susan F. Smith, Olympia, WA (US);

Jeffory L. Smalley, East Olympia, WA (US);

Mani Prakash, University Place, WA (US);

Thu Huynh, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H01L 25/065 (2013.01); H01L 25/50 (2013.01); H01L 21/4882 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 2023/4037 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4068 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.


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