Intel Corporation

Phil Geng

David Shia

Jeffory L Smalley

Ralph V Miele

Sandeep Ahuja

George Vergis

Xiang Li

Mani Prakash

Mengqi Liu

Olaotan Elenitoba-Johnson

Barrett M Faneuf

Jin Yang

Casey R Winkel

Eric W Buddrius

Kenan Huseyin Arik

Stephen C Joy

Aaron P Anderson

Marc Milobinski

Brendan T Pavelek

Fernando Gonzalez Lenero

Carlos Alvizo Flores

Minh T D Le

Ravindranath Vithal Mahajan

Je-Young Chang

Dingying David Xu

Xiaoning Ye

Mohanraj Prabhugoud

Eric Dwight McAfee

Craig J Jahne

Susan F Smith

Patrick Nardi

Timothy Glen Hanna

Shrenik Kothari

Prasanna Raghavan

John Harper

Jimmy Chuang

Andres Ramirez Macias

Scott Dixon

Gilberto Rayas Paredes

Jorge Contreras Perez

Eric D Mcafee

Eric Erike

Yang Jiao

Ulises Encarnacion

Sri Priyanka Tunuguntla

Shaun G Immeker

Jacob Mcmillian

Sean T Sivapalan

Sanjoy Saha

Francisco Gabriel Lozano Sanchez

Maria De La Luz Belmont Velazquez

Daniel E Shier

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load

An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

Semiconductor chip package thermo-mechanical cooling assembly

An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass

A memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard are described, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an load member extending through an opening in the first lever, a second lever coupled to the load member via a second pivot point, and a spring to bias the load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading.

DIMM retention assembly for compression mount technology and land grid array connector loading

Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

Technologies for processor loading mechanisms

An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

Magnetically secured semiconductor chip package loading assembly

An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force

An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention

Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

Cold plate architecture for liquid cooling of devices

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.

Retention latch with spring mechanism

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

Connector retention mechanism for improved structural reliability

An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Multi-surface heat sink suitable for multi-chip packages

A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.

Memory module connector, memory module, and pivotable latch

Growing community of inventors

Portland, OR, United States of America

Phil Geng