The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Sep. 13, 2021
Intel Corporation, Santa Clara, CA (US);
Phil Geng, Washougal, WA (US);
Ralph V. Miele, Hillsboro, OR (US);
David Shia, Portland, OR (US);
Jeffory L. Smalley, Olympia, WA (US);
Eric W. Buddrius, Hillsboro, OR (US);
Sean T. Sivapalan, Portland, OR (US);
Olaotan Elenitoba-Johnson, Tigard, OR (US);
Mengqi Liu, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.