The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Mar. 24, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Phil Geng, Washougal, WA (US);

Patrick Nardi, Scottsdale, AZ (US);

Ravindranath V. Mahajan, Chandler, AZ (US);

Dingying David Xu, Chandler, AZ (US);

Prasanna Raghavan, Chandler, AZ (US);

John Harper, Chandler, AZ (US);

Sanjoy Saha, Portland, OR (US);

Yang Jiao, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/49816 (2013.01);
Abstract

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.


Find Patent Forward Citations

Loading…