Company Filing History:
Years Active: 2017-2025
Title: Inventor Prasanna Raghavan: Pioneering Innovations in Optoelectronics
Introduction
Prasanna Raghavan, an accomplished inventor based in Chandler, Arizona, has made significant contributions in the field of optoelectronics with a total of four patents to his name. His innovative approaches focus on enhancing the performance and reliability of electronic components, particularly through advancements in die structures and packaging architecture.
Latest Patents
Raghavan's latest patents demonstrate his expertise and ingenuity. One notable invention is the "Die Back Side Structures for Warpage Control." This patent describes a foundation layer featuring a stiffener and methods for its formation. The invention involves forming one or more dies over the foundation layer, with each die having an electrically coupled front side surface. A stiffening layer is created on the back side surface of at least one of these dies, which serves to minimize warpage effects based on foundational elements. The materials used in the stiffening layer can include a variety of options such as metals, metal alloys, and ceramics, with the formation process involving cold spray technology.
Another groundbreaking patent from Raghavan is the "Coreless Package Architecture for Multi-Chip Opto-Electronics." This patent outlines an optoelectronic apparatus consisting of a substrate with a ball grid array (BGA) field on one side. Integrated circuits (ICs) are thermally interfaced with a printed circuit board via this substrate. Additionally, optical ICs are coupled to the opposite side, communicating with the ICs through provided interconnects, and some optical ICs are further enhanced with integrated heat spreaders to effectively dissipate heat generated during operation.
Career Highlights
Prasanna Raghavan's career is marked by his association with Intel Corporation, a leading technology company renowned for its innovations in computing technology. His contributions to the field of electronics through research and development at Intel have helped push the boundaries of conventional technology.
Collaborations
Throughout his career, Raghavan has collaborated with talented professionals including Huiyang Fei and Pramod Malatkar. These partnerships exemplify the importance of teamwork in driving technological advancements within the industry.
Conclusion
Prasanna Raghavan stands out as a key inventor in the advancement of optoelectronics. His patented innovations in die back side structures and package architectures reflect a commitment to enhancing the performance and efficiency of electronic devices. As technology continues to evolve, Raghavan's contributions are likely to pave the way for future advancements in this critical field.