The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Jun. 24, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Naga Sivakumar Yagnamurthy, Chandler, AZ (US);
Huiyang Fei, Chandler, AZ (US);
Pramod Malatkar, Chandler, AZ (US);
Prasanna Raghavan, Chandler, AZ (US);
Robert Nickerson, Chandler, AZ (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); B29C 70/84 (2006.01); B29C 70/70 (2006.01); B29C 70/88 (2006.01); B29C 37/00 (2006.01); B29C 33/00 (2006.01); B29C 69/00 (2006.01); G11C 11/401 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); G11C 5/04 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B29C 33/0033 (2013.01); B29C 37/0025 (2013.01); B29C 69/001 (2013.01); B29C 70/70 (2013.01); B29C 70/84 (2013.01); B29C 70/882 (2013.01); G11C 11/401 (2013.01); H01L 23/48 (2013.01); H01L 23/49811 (2013.01); H01L 25/105 (2013.01); H05K 1/111 (2013.01); B29K 2063/00 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3481 (2013.01); G11C 5/04 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01); H05K 1/144 (2013.01); H05K 2201/0379 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10159 (2013.01); H05K 2203/041 (2013.01);
Abstract
Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die.