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Pramod Malatkar

This inventor holds 32 USPTO granted patents and 21 published patent applications and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2007-2026.

USPTO Granted Patents = 32 (Patent Applications = 21)

% Patents Active = 71.9

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 2.7

ph-index = 6

Forward Citations = 129(Granted Patents)

Location History:

Chandler, AZ (2022)
Chandler, AZ (US) (2007 - 2024)

Company Filing History:

32 out of 56,184

Intel Corporation

patents

Years Active: 2007-2026

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Areas of Expertise:

Heat Spreader Structures

Ball-Grid-Array Packages

Mechanical Failure Monitoring

Die Back Side Structures

Bumpless Build-Up Layer Packages

Integrated Circuit Packages

Stretchable Electronics Testing

Thermal Solutions for 3D Packaging

EMI Shield for RF Integration

Microelectronic Package Warpage Control

Vacuum Lamination Techniques

Embedded Microelectronic Devices

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12727523 - Varied ball ball-grid-array (BGA) packages (2026-09-01),

2. 11923268 - Printed heat spreader structures and methods of providing same (2024-03-05),

3. 11916003 - Varied ball ball-grid-array (BGA) packages (2024-02-27),

4. 11327050 - Mechanical failure monitoring, detection, and classification in electronic assemblies (2022-05-10),

5. 11322456 - Die back side structures for warpage control (2022-05-03),

6. 11201128 - Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages (2021-12-14),

7. 10985080 - Electronic package that includes lamination layer (2021-04-20),

8. 10957656 - Integrated circuit packages with patterned protective material (2021-03-23),

9. 10634594 - Membrane test for mechanical testing of stretchable electronics (2020-04-28),

10. 10607909 - Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging (2020-03-31),

11. 10499461 - Thermal head with a thermal barrier for integrated circuit die processing (2019-12-03),

12. 10475750 - Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration (2019-11-12),

13. 10290569 - Constrained cure component attach process for improved IC package warpage control (2019-05-14),

14. 10278318 - Method of assembling an electronic component using a probe having a fluid thereon (2019-04-30),

15. 10231338 - Methods of forming trenches in packages structures and structures formed thereby (2019-03-12),

Title: Innovator Spotlight: Pramod Malatkar, Pioneering Heat Conduction Technologies

Introduction: Pramod Malatkar, a prolific inventor based in Chandler, Arizona, has made significant strides in the field of heat conduction technologies. With an impressive portfolio of 31 patents to his name, Malatkar continues to push the boundaries of innovation at Intel Corporation.

Latest Patents: One of Malatkar's latest patents focuses on printed heat spreader structures and methods of enhancing heat conduction in packaged devices. By leveraging 3D printing techniques, he has developed a heat spreader that optimizes thermal conductivity by strategically depositing layers of a thermal conductor material over IC dies. Additionally, Malatkar's innovation includes the fabrication of pore structures within the heat spreader to regulate thermal conductivity in different directions of heat flow.

Career Highlights: Throughout his career at Intel Corporation, Pramod Malatkar has been instrumental in developing varied ball-grid-array (BGA) packages that enhance electronic packaging solutions. By designing electronic packages with distinct interconnect volumes and material compositions, he has revolutionized the efficiency and performance of these critical components in semiconductor devices.

Collaborations: Malatkar's collaborative efforts with esteemed colleagues such as Kyle Yazzie and Robert L. Sankman have further amplified the impact of his inventions in the industry. Together, they have advanced the realm of heat conduction technologies and electronic packaging, solidifying their roles as pioneers in the field.

Conclusion: Pramod Malatkar's relentless pursuit of innovation and his groundbreaking contributions to heat conduction technologies exemplify his dedication to advancing the semiconductor industry. His impressive patent portfolio is a testament to his ingenuity and expertise, solidifying his reputation as a visionary inventor at the forefront of technological advancements.

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