The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Sep. 18, 2019
Intel Corporation, Santa Clara, CA (US);
Xiao Lu, Chandler, AZ (US);
Jiongxin Lu, Chandler, AZ (US);
Christopher Combs, Portland, OR (US);
Alexander Huettis, Aloha, OR (US);
John Harper, Chandler, AZ (US);
Jieping Zhang, Mesa, AZ (US);
Nachiket R. Raravikar, Gilbert, AZ (US);
Pramod Malatkar, Chandler, AZ (US);
Steven A. Klein, Chandler, AZ (US);
Carl Deppisch, Tempe, AZ (US);
Mohit Sood, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.