This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2024-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024-2026
Title: Biography of Inventor Mohit Sood
Introduction: Mohit Sood is an accomplished inventor based in Chandler, Arizona. He is known for his innovative contributions to the field of electronic packaging.
Latest Patents: Mohit holds a patent for Varied Ball Grid Array (BGA) packages. This patent includes embodiments that describe electronic packages comprising a first substrate, a second substrate, and an array of interconnects that electrically couple the two substrates. The array of interconnects features first interconnects with a specific volume and material composition, as well as second interconnects that differ in volume and/or material composition.
Career Highlights: Mohit Sood is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his work in electronic packaging.
Collaborations: Throughout his career, Mohit has collaborated with notable colleagues, including Xiao Lu and Jiongxin Lu. These collaborations have contributed to the advancement of innovative technologies in the industry.
Conclusion: Mohit Sood's work exemplifies the spirit of innovation in the field of electronics. His contributions, particularly in the area of BGA packages, highlight his role as a significant inventor in the technology sector.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile