Jieping Zhang

Title: Biography of Inventor Jieping Zhang

Introduction

Jieping Zhang is an accomplished inventor based in Chandler, AZ (US). He holds two patents that showcase his innovative contributions to the field of electronic packaging and measurement technologies. His work has significantly impacted the development of advanced electronic systems.

Latest Patents

One of Jieping Zhang's latest patents is for Varied ball ball-grid-array (BGA) packages. This invention includes electronic packages that consist of a first substrate, a second substrate, and an array of interconnects that electrically couple the two substrates. The array features first interconnects with a specific volume and material composition, as well as second interconnects that differ in volume and/or material composition. Another notable patent is for the inline measurement of molding material thickness using terahertz reflectance. This method involves emitting a terahertz beam at a layer of molding material, detecting the reflectance, and determining the thickness of the layer based on the time delay of the reflected beam.

Career Highlights

Jieping Zhang is currently employed at Intel Corporation, where he applies his expertise in electronic packaging and measurement technologies. His innovative work has contributed to the advancement of Intel's product offerings and has positioned him as a key player in the field.

Collaborations

Throughout his career, Jieping Zhang has collaborated with notable colleagues, including Shuhong Liu and Nilanjan Z