This inventor holds 40 USPTO granted patents and 1 published patent application, primarily in Thermal Interface Materials. Top assignee: Intel Corporation. Active years: 2003-2026.
Location History:
- Phoenix, AZ (US) (2003 - 2008)
- Phoeniz, AZ (US) (2010)
- Chandler, AZ (US) (2006 - 2020)
- Tempe, AZ (US) (2024)
Company Filing History:
Years Active: 2003-2026
Areas of Expertise:
Title: **Carl L Deppisch: Innovator in Electronic Packaging**
Introduction
Carl L Deppisch, located in Chandler, AZ, is a prominent inventor with an impressive portfolio of 39 patents. His contributions to the field of electronic packaging and materials science have played a significant role in advancing technology and improving product efficiency.
Latest Patents
Deppisch's latest patents showcase innovative solutions in the realm of electronic packaging. One of his notable patents is for varied ball ball-grid-array (BGA) packages. This invention involves electronic packages that comprise a first substrate, a second substrate, and an array of interconnects that electrically couple the two substrates. The innovation lies in the design of the array of interconnects, featuring first interconnects with unique volume and material compositions, differentiated from second interconnects. This allows for enhanced performance and adaptability in electronic applications.
Another recent innovation by Deppisch includes a conductive foam composite. This invention describes devices and methods utilizing a conductive foam, incorporating pores within the material to enable compressibility. The foam operates effectively between uncompressed and compressed states, with the compressed thickness reaching ninety-five percent or less of its original thickness. Additionally, the filler within the foam enhances thermal conductivity, offering improved heat management in various applications.
Career Highlights
Throughout his career, Deppisch has established himself as a valuable asset in the technology sector. He currently works at Intel Corporation, a leading company in semiconductor manufacturing and technological innovation. His work has focused on developing advanced materials and designs for electronic components, significantly contributing to the efficiency and capabilities of modern electronic devices.
Collaborations
Deppisch collaborates with other talented individuals in his field, including colleagues Fay Hua and Thomas John Fitzgerald. Their combined expertise fosters an environment of innovation and creativity, driving forward projects that push the boundaries of technology.
Conclusion
Carl L Deppisch stands out as a remarkable inventor whose work continues to influence the landscape of electronic packaging. With his extensive portfolio of patents and ongoing collaborations, he remains at the forefront of innovations essential for advancing technology in the modern world.