The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Aug. 30, 2011
Mukul Renavikar, Chandler, AZ (US);
Daewoong Suh, Phoenix, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Abhishek Gupta, Chandler, AZ (US);
Mukul Renavikar, Chandler, AZ (US);
Daewoong Suh, Phoenix, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Abhishek Gupta, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed.