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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Daewoong Suh

USPTO Granted Patents = 40 

Average Co-Inventor Count = 2.0

ph-index = 7

Forward Citations = 197(Granted Patents)


Location History:

  • Chandler, AZ (US) (2008 - 2011)
  • Phoenix, AZ (US) (2007 - 2018)

Company Filing History:

goldMedal38 out of 54,814 
 
Intel Corporation
 patents
silverMedal1 out of 4,554 
 
California Institute of Technology
 patents
bronzeMedal1 out of 832,880 
Other
 patents

Years Active: 2007-2018

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Areas of Expertise:
Carbon Nanotubes
Microelectronic Packaging
Thermal Interface Materials
Solder Joint Reliability
Bulk Metallic Glass
Interconnect Structures
High Temperature Materials
Solder Composites
Nanostructure-Based Interconnect
Stress Compensation Layers
Integrated Heat Spreaders
Stacked-Die Devices
40 patents (USPTO):Explore Patents
1. 9929080 - Forming a stress compensation layer and structures formed thereby (2018-03-27),
2. 9214420 - Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same (2015-12-15),
3. 9142480 - Microelectronic package with high temperature thermal interface material (2015-09-22),
4. 8901753 - Microelectronic package with self-heating interconnect (2014-12-02),
5. 8558218 - Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivites and structures formed thereby (2013-10-15),
6. 8436470 - Solder joint reliability in microelectronic packaging (2013-05-07),
7. 8409929 - Forming a semiconductor package including a thermal interface material (2013-04-02),
8. 8378504 - Microelectronic package with self-heating interconnect (2013-02-19),
9. 8344483 - Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same (2013-01-01),
10. 8174113 - Methods of fabricating robust integrated heat spreader designs and structures formed thereby (2012-05-08),
11. 8158968 - Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivities and structures formed thereby (2012-04-17),
12. 8124517 - Method of forming an interconnect joint (2012-02-28),
13. 8100314 - Carbon nanotubes solder composite for high performance interconnect (2012-01-24),
14. 8030757 - Forming a semiconductor package including a thermal interface material (2011-10-04),
15. 8018063 - Solder joint reliability in microelectronic packaging (2011-09-13),

Title: Innovations by Daewoong Suh: Pioneering Microelectronic Structures

Introduction

Daewoong Suh, based in Phoenix, AZ, is an accomplished inventor recognized for his significant contributions to the field of microelectronics. With 40 patents to his name, his inventive work has greatly influenced technological advancements and methodologies in electronics manufacturing.

Latest Patents

Suh's recent patents focus on advanced methods for forming microelectronic structures. One of his notable inventions involves the creation of a stress compensation layer on a substrate. This method includes forming at least one opening within the stress compensation layer and incorporating an interconnect paste within that opening. Additionally, he has developed carbon nanotube-solder composite structures for use in interconnects. This involves patterning a carbon nanotube (CNT) array on various substrates, such as microelectronic dies and interposer structures, utilizing chemical vapor deposition methods or patterned masks. His innovations also extend to computing systems that utilize the CNT arrays for efficient heat transfer from microelectronic devices.

Career Highlights

Daewoong Suh has carved a remarkable career path, having worked with leading organizations in the technology sector. He has been part of Intel Corporation, a global leader in semiconductor manufacturing, where he contributed to cutting-edge developments. In addition, his tenure at the California Institute of Technology has further enriched his expertise and allowed him to explore various innovative avenues.

Collaborations

Throughout his career, Suh has collaborated with esteemed professionals, including Nachiket R. Raravikar and Mukul P. Renavikar, both of whom have played vital roles in advancing research and development in related fields. These partnerships highlight the collaborative nature of innovation and the importance of interdisciplinary teamwork in achieving groundbreaking advancements.

Conclusion

Daewoong Suh’s contributions to microelectronics through his extensive patent portfolio and collaborations with industry leaders exemplify his commitment to innovation. His patents not only address current challenges in the field but also pave the way for future technological advancements. As he continues to innovate, his work will undoubtedly influence the evolution of microelectronic devices and systems.

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