The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Sep. 17, 2008
Abhishek Gupta, Chandler, AZ (US);
Mike Boyd, Chandler, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Jinlin Wang, Chandler, AZ (US);
Daewoong Suh, Phoenix, AZ (US);
Brad Drew, Mesa, AZ (US);
Abhishek Gupta, Chandler, AZ (US);
Mike Boyd, Chandler, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Jinlin Wang, Chandler, AZ (US);
Daewoong Suh, Phoenix, AZ (US);
Brad Drew, Mesa, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.