This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Mike Boyd - Innovator in Microelectronic Packaging
Introduction
Mike Boyd is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of microelectronics, particularly in the area of heat spreader designs. His innovative work has led to advancements that enhance the performance and reliability of microelectronic devices.
Latest Patents
Mike Boyd holds a patent for "Methods of fabricating robust integrated heat spreader designs and structures formed thereby." This patent focuses on methods and associated structures for forming an indium-containing solder material directly on an active region of a copper integrated heat spreader (IHS). The invention enables the formation of a copper indium-containing solder intermetallic on the active region of the IHS. This solder intermetallic significantly improves the solder-thermal interface material (TIM) integration process for microelectronic packaging applications. He has 1 patent to his name.
Career Highlights
Mike Boyd is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that shape the future of electronics.
Collaborations
Mike has collaborated with talented individuals such as Abhishek Gupta and Daewoong Suh. Their combined expertise has fostered an environment of innovation and creativity within their projects.
Conclusion
Mike Boyd's contributions to microelectronic packaging through his innovative patent and work at Intel Corporation highlight his role as a key inventor in the field. His advancements continue to influence the development of reliable microelectronic devices.