The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Aug. 15, 2008
Applicants:

Sabina Houle, Phoenix, AZ (US);

Daewoong Suh, Phoenix, AZ (US);

Charles Hill, Gilbert, AZ (US);

Inventors:

Sabina Houle, Phoenix, AZ (US);

Daewoong Suh, Phoenix, AZ (US);

Charles Hill, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/24 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/24 (2013.01); H05K 7/20481 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1433 (2013.01);
Abstract

A microelectronic package is provided. The microelectronic package includes a substrate, a die coupled to a top surface of the substrate and a integrated heat spreader thermally coupled to the die, wherein the integrated heat spreader comprises integrated heat spreader walls. The microelectronic package also includes a thermal interface material disposed between the die and the integrated heat spreader and an underfill material disposed between the integrated heat spreader and the substrate, wherein the underfill material is disposed within gaps between the integrated heat spreader walls, the die and the thermal interface material.


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