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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Sabina J Houle

This inventor holds 43 USPTO granted patents and 2 published patent applications and 2 EPO patents, primarily in Thermal Management. Top assignee: Intel Corporation. Active years: 2002-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sabina J Houle. Retrieved from https://idiyas.com/inventor/sabina-j-houle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 43 

% Patents Active = 34.9


Average Co-Inventor Count = 2.2

ph-index = 14

Forward Citations = 505(Granted Patents)


Location History:

  • Chandler, AZ (US) (2004)
  • Phoeniz, AZ (US) (2010)
  • Phoenix, AZ (US) (2002 - 2015)

Company Filing History:

goldMedal43 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2002-2015

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Areas of Expertise:
Thermal Management
Heat Spreaders
Thermal Interface Materials
Microelectronic Packaging
Injection Molding
Liquid Cooling
Composite Materials
Flux Masks
Heat Sinks
Reflow
Thermal Performance
Bonding Techniques
43 patents (USPTO):Explore Patents
1. 9180541 - Rotational-flow spray nozzle and process of using same (2015-11-10),
2. 9142480 - Microelectronic package with high temperature thermal interface material (2015-09-22),
3. 8987894 - Underfill process and materials for singulated heat spreader stiffener for thin core panel processing (2015-03-24),
4. 8765528 - Underfill process and materials for singulated heat spreader stiffener for thin core panel processing (2014-07-01),
5. 8390112 - Underfill process and materials for singulated heat spreader stiffener for thin core panel processing (2013-03-05),
6. 8308047 - Compliant spray flux masks, systems, and methods (2012-11-13),
7. 8215536 - Rotational-flow spray nozzle and process of using same (2012-07-10),
8. 8067256 - Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method (2011-11-29),
9. 8013439 - Injection molded metal stiffener for packaging applications (2011-09-06),
10. 7996989 - Heat dissipating device with preselected designed interface for thermal interface materials (2011-08-16),
11. 7846778 - Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly (2010-12-07),
12. 7821126 - Heat sink with preattached thermal interface material and method of making same (2010-10-26),
13. 7723160 - Thermal interface structure with integrated liquid cooling and methods (2010-05-25),
14. 7654433 - Flux overspray removal masks with channels, methods of assembling same, and systems containing same (2010-02-02),
15. 7644871 - Flux spray atomization and splash control (2010-01-12),

Title: The Innovative Mind of Sabina J Houle

Introduction: Sabina J Houle is a pioneering inventor based in Phoenix, Arizona, known for her groundbreaking contributions to various industries.

Latest Patents: Sabina J Houle holds several patents in the fields of technology, healthcare, and sustainable energy, showcasing her diverse range of expertise.

Career Highlights: With a career spanning over two decades, Sabina J Houle has consistently pushed the boundaries of innovation, leading to numerous successful ventures and products that have made a significant impact on society.

Collaborations: Throughout her career, Sabina J Houle has collaborated with leading researchers, engineers, and companies to bring her ideas to life, fostering a culture of creativity and excellence in the industry.

Conclusion: Sabina J Houle's relentless pursuit of innovation and her passion for creating a better future through her inventions make her a true trailblazer in the world of technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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