The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Jul. 16, 2010
Applicants:
Lakshmi Supriya, Arlington, MA (US);
Daewoong Suh, Phoenix, AZ (US);
Inventors:
Lakshmi Supriya, Arlington, MA (US);
Daewoong Suh, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming an interconnect joint includes providing a first metal layer (), providing a film () including metal particles () and organic molecules (), placing the film over the first metal layer, placing a second metal layer () over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.