The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Dec. 30, 2009
Deepak V. Kulkarni, Chandler, AZ (US);
Carl L. Deppisch, Chandler, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Gregory S. Constable, Chandler, AZ (US);
Sriram Srinivasan, Chandler, AZ (US);
Deepak V. Kulkarni, Chandler, AZ (US);
Carl L. Deppisch, Chandler, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Gregory S. Constable, Chandler, AZ (US);
Sriram Srinivasan, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.