Chandler, AZ, United States of America

Gregory S Constable

USPTO Granted Patents = 7 

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2010-2017

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7 patents (USPTO):Explore Patents

Title: Innovations of Gregory S. Constable

Introduction

Gregory S. Constable is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronics through his innovative patents. With a total of seven patents to his name, Constable has demonstrated a commitment to advancing technology and improving product reliability.

Latest Patents

Among his latest patents, one is titled "Methods of fabricating low melting point solder reinforced sealant and structures formed thereby." This patent describes methods and associated structures for forming a package structure that includes a low melting point solder material. The process involves forming a sealant in a specific region, attaching an integrated heat spreader (IHS) to the sealant, and curing the sealant to create a solder joint. Another significant patent is "Flexible underfill compositions for enhanced reliability." This patent outlines underfill materials for fabricating electronic devices, including a unique epoxy mixture that enhances the reliability of electronic components.

Career Highlights

Gregory S. Constable is currently employed at Intel Corporation, where he continues to innovate and contribute to the development of advanced electronic materials. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Constable has collaborated with notable colleagues, including Nisha Ananthakrishnan and Deepak Kulkarni. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Gregory S. Constable's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His innovative approaches continue to shape the future of electronic device fabrication.

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