The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2010

Filed:

Sep. 30, 2008
Applicants:

Nirupama Chakrapani, Gilbert, AZ (US);

Vijay S Wakharkar, Paradise Valley, AZ (US);

Janet Feng, Chandler, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Shankar Ganapathysubramanian, Phoenix, AZ (US);

Gregory S Constable, Chandler, AZ (US);

Inventors:

Nirupama Chakrapani, Gilbert, AZ (US);

Vijay S Wakharkar, Paradise Valley, AZ (US);

Janet Feng, Chandler, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Shankar Ganapathysubramanian, Phoenix, AZ (US);

Gregory S Constable, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.


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