IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Nisha Ananthakrishnan

USPTO Granted Patents = 22 

 

Average Co-Inventor Count = 6.1

ph-index = 3

Forward Citations = 39(Granted Patents)


Company Filing History:

goldMedal22 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2010-2025

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):
1. 12417958 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone (2025-09-16),
2. 12347743 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone (2025-07-01),
3. 12315777 - Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone (2025-05-27),
4. 11804470 - Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control (2023-10-31),
5. 11776821 - Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap (2023-10-03),
6. 11282717 - Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap (2022-03-22),
7. 10475715 - Two material high K thermal encapsulant system (2019-11-12),
8. 10115606 - Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby (2018-10-30),
9. 9704767 - Mold compound with reinforced fibers (2017-07-11),
10. 9640415 - Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials (2017-05-02),
11. 9631065 - Methods of forming wafer level underfill materials and structures formed thereby (2017-04-25),
12. 9611372 - Narrow-gap flip chip underfill composition (2017-04-04),
13. 9504168 - Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process (2016-11-22),
14. 9458283 - Flexible underfill compositions for enhanced reliability (2016-10-04),
15. 9431274 - Method for reducing underfill filler settling in integrated circuit packages (2016-08-30),

Title: The Innovative Journey of Nisha Ananthakrishnan

Introduction: Nisha Ananthakrishnan, a pioneering inventor based in Chandler, AZ, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Nisha Ananthakrishnan's latest patents include a cutting-edge wearable device for monitoring health metrics in real-time and a revolutionary software application designed to streamline communication in large organizations.

Career Highlights: Throughout her illustrious career, Nisha Ananthakrishnan has been recognized for her exceptional problem-solving skills and her ability to transform complex ideas into practical solutions. She has received multiple awards for her innovative work in the tech industry.

Collaborations: Nisha Ananthakrishnan has collaborated with leading research institutions and tech companies to further develop and implement her inventions. Her collaborative spirit has led to the successful integration of her technologies into various sectors.

Conclusion: Nisha Ananthakrishnan's passion for innovation and her dedication to pushing the boundaries of technology continue to inspire the next generation of inventors. Her impact on the tech industry is truly remarkable.

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