The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jun. 17, 2015
Intel Corporation, Santa Clara, CA (US);
Venmathy McMahan, Phoenix, AZ (US);
Sivakumar Nagarajan, Chandler, AZ (US);
Elah Bozorg-Grayeli, Chandler, AZ (US);
Amrita Mallik, Chandler, AZ (US);
Kuang-Han Chu, Somerville, MA (US);
Liwei Wang, Phoenix, AZ (US);
Nisha Ananthakrishnan, Chandler, AZ (US);
Craig J. Weinman, Mesa, AZ (US);
Amram Eitan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.