Chandler, AZ, United States of America

Sivakumar Nagarajan

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014-2019

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):

Title: **Innovations by Sivakumar Nagarajan: A Pioneer in Microelectronic Packaging**

Introduction

Sivakumar Nagarajan is an accomplished inventor based in Chandler, AZ, with a strong focus on innovations in microelectronic packaging. With a total of six patents to his name, Nagarajan has made significant contributions to the field that enhance the performance and reliability of electronic devices.

Latest Patents

Nagarajan's recent work includes groundbreaking inventions such as a "Two material high K thermal encapsulant system." This electronic package invention features an innovative design where a first die and a second die are stacked together with unique encapsulants strategically positioned between them. The first encapsulant utilizes a material with higher thermal conductivity, while the second encapsulant promotes superior electrical connections between the dies, showcasing Nagarajan's expertise in optimizing electronic packaging.

Additionally, another noteworthy patent focuses on "Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby." This invention describes methods to modify underfill materials with various components that significantly enhance adhesion. Nagarajan's approach allows for the development of more reliable microelectronic packaging structures, emphasizing the importance of adhesion in electronic device longevity.

Career Highlights

Sivakumar Nagarajan is currently affiliated with Intel Corporation, where he has been instrumental in advancing technologies related to electronic packaging. His expertise in material science and microelectronics has positioned him as a key contributor to Intel’s innovations in this field.

Collaborations

Throughout his career, Nagarajan has worked alongside talented colleagues such as Nisha Ananthakrishnan and Suriyakala Ramalingam. These collaborations have fostered an environment of creativity and innovation, resulting in patents that push the boundaries of technology in microelectronic packaging.

Conclusion

Sivakumar Nagarajan’s contributions to the field of microelectronic packaging through his patents highlight his commitment to innovation. His work at Intel Corporation, alongside esteemed colleagues, continues to inspire advancements in technology, ensuring that electronic devices perform efficiently and reliably. His ongoing dedication to research and development will undoubtedly lead to further innovations in the future.

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