Intel Corporation

Sivakumar Nagarajan

Nisha Ananthakrishnan

Suriyakala Ramalingam

Saikumar Jayaraman

Sandeep Razdan

Yiqun Bai

Arjun Krishnan

Yonghao Xiu

Yuying Wei

Craig Jonathan Weinman

Beverly J Canham

Vipul V Mehta

Amram Eitan

Rajen S Sidhu

Elah Bozorg-Grayeli

Wei Tan

Liwei Wang

Kabirkumar Mirpuri

Venmathy McMahan

Amrita Mallik

Kuang-Han Chu

Craig J Weinman

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Two material high K thermal encapsulant system

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250&#xb0; C.-300&#xb0; C. at a ramp rate of 50&#xb0; C./second-100&#xb0; C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.

Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process

Embodiments of the present disclosure are directed toward underfill material including block copolymer. In one embodiment, an underfill material includes epoxy material and a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.

Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus

Embodiments of the present disclosure are directed towards techniques and configurations for surface treatment of an integrated circuit (IC) substrate. In one embodiment, an apparatus includes an integrated circuit substrate, an interconnect structure disposed on the integrated circuit substrate, the interconnect structure being configured to route electrical signals to or from the integrated circuit substrate and comprising a metal surface, and a protective layer disposed on the metal surface of the interconnect structure, the protective layer comprising a first functional group bonded with the metal surface and a second functional group bonded with the first functional group, wherein the second functional group is hydrophobic to inhibit contamination of the metal surface by hydrophilic materials and further inhibits oxidation of the metal surface. Other embodiments may be described and/or claimed.

Techniques and configurations for surface treatment of an integrated circuit substrate

Growing community of inventors

Chandler, AZ, United States of America

Sivakumar Nagarajan