The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Apr. 26, 2016
Intel Corporation, Santa Clara, CA (US);
Yiqun Bai, Chandler, AZ (US);
Yuying Wei, Chandler, AZ (US);
Arjun Krishnan, Chandler, AZ (US);
Suriyakala Ramalingam, Chandler, AZ (US);
Yonghao Xiu, Chandler, AZ (US);
Beverly J. Canham, Mesa, AZ (US);
Sivakumar Nagarajan, Chandler, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Nisha Ananthakrishnan, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.