IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Yiqun Bai

USPTO Granted Patents = 19 

 

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 313(Granted Patents)


Company Filing History:

goldMedal19 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2008-2024

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19 patents (USPTO):
1. 12130482 - Hydrophobic feature to control adhesive flow (2024-10-29),
2. 12099245 - Completely encapsulated optical multi chip package (2024-09-24),
3. 12068222 - Dummy die structures of a packaged integrated circuit device (2024-08-20),
4. 11749585 - High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package (2023-09-05),
5. 11688634 - Trenches in wafer level packages for improvements in warpage reliability and thermals (2023-06-27),
6. 11574851 - Coupled cooling fins in ultra-small systems (2023-02-07),
7. 11562940 - Integrated heat spreader comprising a silver and sintering silver layered structure (2023-01-24),
8. 11545407 - Thermal management solutions for integrated circuit packages (2023-01-03),
9. 10115606 - Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby (2018-10-30),
10. 9704767 - Mold compound with reinforced fibers (2017-07-11),
11. 9611372 - Narrow-gap flip chip underfill composition (2017-04-04),
12. 9431274 - Method for reducing underfill filler settling in integrated circuit packages (2016-08-30),
13. 9330993 - Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby (2016-05-03),
14. 9269596 - Narrow-gap flip chip underfill composition (2016-02-23),
15. 9230833 - Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures (2016-01-05),

Title: The Innovative Journey of Yiqun Bai

Introduction: Yiqun Bai, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Yiqun Bai holds several patents in the areas of artificial intelligence, renewable energy, and advanced materials, showcasing his diverse range of expertise and creativity.

Career Highlights: With a background in engineering and a passion for problem-solving, Yiqun Bai has successfully developed cutting-edge solutions that have garnered attention in the industry. His commitment to pushing the boundaries of technology is evident in his impressive portfolio of inventions.

Collaborations: Throughout his career, Yiqun Bai has collaborated with leading research institutions and tech companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several innovative projects.

Conclusion: Yiqun Bai's relentless pursuit of innovation and his dedication to creating solutions that make a difference highlight him as a visionary inventor shaping the future of technology.

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