The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Jan. 10, 2019
Intel Corporation, Santa Clara, CA (US);
Kumar Abhishek Singh, Phoenix, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Nitin Deshpande, Chandler, AZ (US);
Mitul Modi, Phoenix, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Aastha Uppal, Chandler, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Sanka Ganesan, Chandler, AZ (US);
Yiqun Bai, Chandler, AZ (US);
Jan Krajniak, Phoenix, AZ (US);
Manish Dubey, Chandler, AZ (US);
Ravindranath Mahajan, Chandler, AZ (US);
Ram Viswanath, Phoenix, AZ (US);
James C. Matayabas, Jr., Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.